PART |
Description |
Maker |
UJA1075ATW |
High-speed CAN/ LIN core system basis chip
|
NXP Semiconductors
|
UJA1065 UJA1065TW |
High-speed CAN/LIN fail-safe system basis chip
|
Philips Semiconductors
|
UJA1079ATW |
LIN core system basis chip
|
NXP Semiconductors
|
UJA1061 UJA1061TW |
Low speed CAN/LIN system basis chip
|
NXP Semiconductors
|
MCZ33903CS5EK/R2 MCZ33903CS5EKR2 MCZ33903C3EK/R2 M |
SBC Gen2 with CAN High Speed and LIN Interface
|
Freescale Semiconductor, Inc
|
MC33910 MC33910G5AC_R2 MC34910G5AC_R2 |
LIN System Basis Chip with High Side Drivers
|
Freescale Semiconductor, Inc
|
AD7891ACHIPS-2 AD7891ACHIPS-1 AD7891AP-1REEL AD789 |
LC MOS 8-Channel, 12-Bit High Speed Data Acquisition System True Bipolar Input, Single Supply, Parallel, 8-Channel, 12-Bit High Speed Data Acquisition System LC2MOS 8-Channel, 12-Bit High Speed Data Acquisition System
|
Analog Devices
|
W26L010A W26L010A-10 W26L010A-12 W26L010AJ-10 W26L |
JT 10C 10#20 PIN RECP From old datasheet system 64K X 16 High Speed CMOS Static RAM HIGH SPEED SRAM 64Kx16
|
Winbond Electronics Corp WINBOND[Winbond]
|
NTE216 |
Silicon NPN Transistor High Speed Switch, Core Driver
|
NTE[NTE Electronics]
|
33663 |
LIN 2.1 / SAEJ2602-2 Dual LIN Physical Layer
|
Freescale Semiconductor
|
CW201212-R33J CW201212-12NJ CW201212-R56J CW201212 |
MAGNETICS-HIGH Q CHIP INDUCTOR 1 ELEMENT, 0.33 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD MAGNETICS-HIGH Q CHIP INDUCTOR 1 ELEMENT, 0.012 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD MAGNETICS-HIGH Q CHIP INDUCTOR 1 ELEMENT, 0.56 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD MAGNETICS-HIGH Q CHIP INDUCTOR 1 ELEMENT, 0.91 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD MAGNETICS-HIGH Q CHIP INDUCTOR 1 ELEMENT, 0.0033 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Inductor; Inductor Type:High Frequency; Inductance:13.3nH; Inductance Tolerance: /- 5 %; Current Rating:600mA; Series:CW201212; Package/Case:0805; Core Material:Alumina Ceramic; Leaded Process Compatible:Yes RoHS Compliant: Yes
|
Bourns, Inc. BOURNS INC
|